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A Patent Technology-Based Diamond Wire Solution

With a series of patents and strong technical reserve, Fundant diamond wire solution is different in:
  • According to different materials of sawing target, sintering different alloy layers on the abrasive surface to generate different special metallic compound abrasive
  • adhering metallic compound abrasive to blank wire with different metal or alloy
  • stronger consolidation of blank wire, flexible particle density and patented design of special diamond wires
Contact us:sales@fundant.com

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